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DS3172 Datasheet Single/dual/triple/quad Ds3/e3 Single-chip Transceivers

Manufacturer: Maxim Integrated (now Analog Devices)

Overview: www.DataSheet4U.com DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines.

FUNCTIONAL DIAGRAM APPLICATIONS Access Concentrators SONET/SDH ADM and Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches Multiservice Access Platform (MSAP) Multiservice Protocol Platform (MSPP) PDH Multiplexer/ Demultiplexer Integrated Access Device (IAD) DS3/E3 PORTS DS3/ E3 LIU DS3/E3 FRAMER/ FORMATTER SYSTEM BACKPLANE DS317x ORDERING INFORMATION PART DS3171* DS3171N* DS3172* DS3172N* DS3173* DS3173N* DS3174 DS3174N TEMP RANGE 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C PIN-PACKAGE 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch)

Key Features

  • Single (DS3171), Dual (DS3172), Triple (DS3173), or Quad (DS3174) Single-Chip Transceiver for DS3 and E3 All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed Circuit Board Platform Each Port Independently Configurable Performs Receive Clock/Data Recovery and Transmit Waveshaping for DS3 and E3 Jitter Attenuator can be Placed Either in the Receive or Transmit Paths Interfaces to 75W.

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