MAX6023 Description
The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™). These devices are guaranteed an initial accuracy of ±0.2% and 30ppm/°C temperature drift over the -40°C to +85°C extended temperature range. UCSPs offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages.
MAX6023 Applications
- UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. See the UCSP Reliability Notice in the UCSP Relia