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Multilayer Chip Beads
Advantages of using Multi Layer Chips Features
1. 2. 3. 4. 5. 6. Small size chips generate high impedance. Minimum floating capacity and excellent high frequency characteristics. Outstanding soldering heat resistance. Both flow and reflow soldering methods can be used. Perfect shape for automatic mounting, with no directionality. Monolithic inorganic material construction for high reliability. Closed magnetic circuit avoids crosstalk and is suited to high density printed circuit boards.
Common Applications for Impedance Chips
Clock generation circuitry, filtering between analogue and digital circuitry, I/O interconnectors (e.g.
BMB2A0120RS2 Datasheet
