ER2D Datasheet | Micro Commercial Components

Features For Mount Applications Surface Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250 °C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency Operating Temperature: -50°C to +150°C Storage Temperature: -50°C to +150°C Maximum Thermal Resistance; 20°C/W Junction To Lead MCC Device Maximum Maximum Maximum Catalog Marking Recurrent RMS DC Number Peak Reverse Voltage Blocking Voltage Voltage ER2A ER2A 50V 35V 50V ER2B ER2B 100V 70V 100V ER2C ER2C 150V 105V 150V ER2D ER2D 200V 140V 200V ER2G ER2G 400V 280V 400V ER2J ER2J 600V 420V 600V ER2K ER2K 800V 560V 800V ER2M ER2M 1000V 700V 1000V IF(AV) IFSM 2.0A 50A TJ = 75°C 8.3ms, half sine DIM A B C D E F G H J - - - Maximum Ratings Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage INCHES MIN .078 .075 .002 ----.035 .065 .205 .160 .130 MAX .116 .089 .008 .02 .055 .091 .224 .180 .155 DIMENSIONS MM MIN 1.98 1.90 .05 ----.90 1.65 5.21 4.06 3.30 ER2A-D ER2G-K ER2M .975V 1.35V 1.60V MAX 2.95 2.25 .20 .51 1.40 2.32 5.69 4.57 3.94 NOTE IFM = 2.0A; TJ = 25°C- TJ = 25°C TJ = 100°C Maximum DC Reverse Current At Rated DC Blocking Voltage Maximum Reverse Recovery Time SUGGESTED SOLDER PAD LAYOUT 0.090" 5µA 150µA 0.085” ER2A-D ER2G-K ER2M Trr CJ 50ns 60ns 100ns Typical Junction Capacitance 25p F IF=0.5A, IR=1.0A, Irr=0.25A Measured at 1.0MHz, VR=4.0V 0.070” - Pulse test: Pulse width 200 µsec, Duty cycle 2% .mccsemi. ER2A thru ER2M Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 .1 .06 .04 .02 .01 .4 .8 1.2 1.6 Volts 2.0 2.4 Amps Figure 2 Forward Derating Curve 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 .8 .6 .4 Single Phase, Half Wave .2 60Hz Resistive or Inductive Load 0 0 25 50 75 °C Average Forward Rectified Current - Amperes versus Ambient Temperature - °C 100 125...