SDB157L Datasheet | Micro Commercial Components

Features Surface Mount Package Low Profile Package Moisture Resistant Epoxy Case High Surge Current Capability - - Maximum Ratings Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +150 °C Maximum Recurrent Peak Reverse Voltage 50V 100V 200V 400V 500V 600V 800V 1000V Maximum RMS Voltage 35V 70V 140V 280V 350V 420V 560V 700V Maximum DC Blocking Voltage 50V 100V 200V 400V 500V 600V 800V 1000V MCC Part Number SDB151L SDB152L SDB153L SDB154L SDB155L SDB156L SDB157L SDB158L ∼ + ∼ Device Marking SDB151 SDB152 SDB153 SDB154 SDB155 SDB156 SDB157 SDB158 Notch in Case H DIMENSIONS INCHES MIN .316 .245 .040 .360 .086 .004 .195 .038 MM MIN 8.05 6.20 1.02 9.40 2.20 0.10 5.00 1.00 Electrical Characteristics @ 25° C Unless Otherwise Specified Average Forward IF(AV) 1.5 A TA = 40°C Current Peak Forward Surge IFSM 50A 8.3ms, half sine Current Maximum 1.1V IFM = 1.5A ; Instantaneous VF Forward Voltage TA = 25°C Maximum DC IR Reverse Current At 10µA TA = 25°C Rated DC Blocking 1.0m A TA = 100 °C Voltage Typical Junction CJ 25p F Measured at Capacitance 1.0MHz, VR=4.0V - Pulse Test: Pulse Width 300µsec, Duty Cycle 1% DIM A B C D E G H K MAX .335 .255 .060 .410 .098 .011 .205 .042 MAX 8.51 6.50 1.52 10.40 2.50 0.28 5.20 1.10 NOTE Suggested Solder Pad Layout .047” .344” .060” .205” Version: 3 .mccsemi. 2003/01/08 SDB151L thru SDB158L Figure 2 Typical Reverse Characteristics 100 60 40 20 10 Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 .1 .06 .04 .02 .01 .4 .6 .8 1.0 1.2 1.4 25°C 6 4 2 µAmps 1 .6 .4 .2 .1 .06 .04 .02 .01 20 40 60 80 Volts Instantaneous Reverse Leakage Current - Micro Amperes versus Percent Of Rated Peak Reverse Voltage - Volts 100 120 140 TA=25°C Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage -...