Microchip Technology LQFP64
64-Lead Low-Profile Plastic Quad Flat Pack Package
64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specification located at 64X TIPS 0.20 C A-B D D D1 D A E1 4 N B E1 E A A NOTE 1 C SEATING PLANE A A2 A1 123 D1 4 TOP VIEW SIDE VIEW 4X 0.20 H A-B D 0.10 C H 64X 0.10 C D2 12 3 N E2 4X 0.20 e BOTTOM VIEW 64x b 0.08 C A-B D Microchip Technology Drawing C04-1080 Rev. A Sheet 1 of 2 © 2019 Microchip Technology Incorporated 64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specification located at α H θ c L (L1) SECTION A-A Number of Leads Lead Pitch Overall Height Units Dimension Limits N e A MILLIMETERS MIN NOM MAX 64 0.50 BSC - - 1.60 Notes: Standoff Molded Package Thickness Foot Length Footprint Foo...