• Part: MSCSM70XM45CTYZBNMG
  • Description: Power Module
  • Manufacturer: Microchip Technology
  • Size: 3.22 MB
MSCSM70XM45CTYZBNMG Datasheet (PDF) Download
Microchip Technology
MSCSM70XM45CTYZBNMG

Key Features

  • The MSCSM70XM45CTYZBNMG device has the following key features
  • Silicon Carbide (SiC) MOSFET
  • SiC Schottky Diode
  • Low stray inductance
  • Lead frames for power connections
  • Si3N4 substrate for improved thermal performance
  • AlSiC base plate for extended reliability and reduced weight
  • Extended storage temperature range
  • Internal thermistor for temperature monitoring
  • Stable temperature behavior

Applications

  • Hybrid Power Device (HPD) for Electro-Mechanical Actuator (EMA) and Electro-Hydrostatic Actuator (EHA)