Microchip Technology UMX812
This line of metal electrode leadless face (MELF) high–power PIN diodes consists of hermetically sealed surface mount packaged devices with full–face bonded chips for low–inductance construction. The MELF ceramic package has square–end terminations, which are ideal for surface mount and pick–and–place operations.| Part No. | UMX812 |
|---|---|
| Datasheet | UMX812 Download |
| Manufacturer |  Microchip Technology |
| Description | MELF PIN Diodes |
| Buy | Stock & Price |
FEATURES
● Low–magnetic (ideal for MRI applications)● Very low inductance, full–face bonding
● High–reliability hermetic design
● Surface mount devices available in tape and reel
● RoHS compliant1
● ESD HMB Class 2 Package Styles
APPLICATIONS
● Designed for low–loss and low–distortion applications● Switch–filter bank
● T/R control
● Attenuators
● MRI switching Performance Overview Parameter Conditions Value Units VB IR = 10 μA 500 V CT at 50V 0.5–1.2 pF Rs at 100 mA 0.40–0.85 Ω Rs at 200 mA 0.2–0.55 Ω TL 1.5–5.5 μs θP 15–35 °C/W Note: 1. RoHS versions are supplied with a matte tin finish. Performance Curves Data Sheet © 2023 Microchip Technology Inc. and its subsidiaries DS00005065A - 1 UMX502—UMX812 Table of Contents Product Overview..................................................................................................................................................................1 1.
ELECTRICAL SPECIFICATIONS
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