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MT29C4G48MAPLCCA-6IT - NAND Flash and Mobile LPDRAM

Download the MT29C4G48MAPLCCA-6IT datasheet PDF. This datasheet also covers the MT29C variant, as both devices belong to the same nand flash and mobile lpdram family and are provided as variant models within a single manufacturer datasheet.

General Description

Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP.

These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements.

Key Features

  • NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1: PoP Block Diagram.
  • Micron® NAND Flash and Mobile LPDRAM components.
  • RoHS-compliant, “green” package.
  • Separate NAND Flash and Mobile LPDRAM interfaces.
  • Space-saving package-on-package combination.
  • Low-voltage operation (1.70.
  • 1.95V).
  • Industrial temperatur.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MT29C_MicronTechnology.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Micron Technology

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MT29C4G48MAPLCCA-75IT NAND Flash and Mobile LPDRAM
MT29C4G48MAPLCJQ-6IT NAND Flash and Mobile LPDRAM
MT29C4G48MAPLCJQ-75IT NAND Flash and Mobile LPDRAM
MT29C4G48MAYAPAKQ-5IT NAND Flash and Mobile LPDDR
MT29C4G48MAZAPAKQ-5IT NAND Flash and Mobile LPDDR

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1: PoP Block Diagram • Micron® NAND Flash and Mobile LPDRAM components • RoHS-compliant, “green” package • Separate NAND Flash and Mobile LPDRAM interfaces • Space-saving package-on-package combination • Low-voltage operation (1.70–1.95V) • Industrial temperature range: –40°C to +85°C NAND Flash Power NAND Flash Device NAND Flash Interface NAND Flash-Specific Features • Organization – Page size x8: 2112 bytes (2048 + 64 bytes) x16: 1056 words (1024 + 32 words) – Block size: 64 pages (128K + 4K bytes) LP-DRAM Power www.DataSheet.