CHF1.5KE18A Datasheet | Microsemi

FEATURES - Unidirectional and Bidirectional - Fully glass passivated - 1500 watt (10/1000 µs) - Eliminates wire bonding - No overshoot - NON Inductive Insertion MECHANICAL - Weight: 0.3 grams (approximate) - Cathode mark on top side - Metallization Cr - Ag - Au (Both Sides) MAXIMUM RATINGS MECHANICAL - Max Junction Temperature: 1750C - Storage Temperature: -550C to +1750C - Flip Chip Peak Pulse Power: 1500 Watts (10/1000 µs) - Maximum non-repetitive peak power 1500 Watts (10/1000 µs) - Total continuous power dissipation @ Tlead = 750C 2.5 W - Turn-on time (theoretical) unidirectional 1X10-12 - Turn-on time (theoretical) bidirectional 1X10-9 PACKAGING - Waffle package - 50 pieces per pack (STANDARD) BIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS PAD SIZE & CIRCUIT MSC0996.PDF ISO 9001 CERTIFIED REV F 7/20/00 CHF1.5KE6.8 thru CHF1.5KE400CA UNIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS VBR 30V and above VBR 30V and below PEAK PULSE POWER Vs PULSE TIME POWER DERATING Peak Pulse Power (Ppp) or current (Ipp) In Percent of 25°C Rating MSC0996.PDF TEMPERATURE...