CHFP6KE110 Datasheet | Microsemi

8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 FLIP-CHIP TVS DIODES CHFP6KE5.0 thru CHFP6KE170CA Features - - - - - - Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS - - - - - - - Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL - Weight: 0.01 grams (approximate) - - Solderable standoff tabs .040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces PACKAGING BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT VBR above 30 V VBR 30V and below MSC1596.PDF ISO 9001 CERTIFIED REV B 3/13/2000 CHFP6KE5.0 thru CHFP6KE170CA PEAK PULSE POWER Vs PULSE TIME Ppp - PEAK PULSE POWER - k...