MPP4204 - (MPP4201 - MPP4700) Pin Diode

Microsemi (now Microchip Technology)

Download the MPP4204 datasheet PDF. This datasheet also covers the MPP4201 variant, as both devices belong to the same (mpp4201 - mpp4700) pin diode family and are provided as variant models within a single manufacturer datasheet.

General Description

KEY

Key Features

!" Tape and Reeled for Automatic Assembly !" Low Series Inductance (.

📥 Download Datasheet

MPP4204 (mpp4201 - mpp4700) pin diode by Microsemi (now Microchip Technology) - Datasheet Preview — Note: The manufacturer provides a single datasheet file (MPP4201_MicrosemiCorporation.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number	MPP4204
Manufacturer	Microsemi (now Microchip Technology)
File Size	93.36 KB
Description	(MPP4201 - MPP4700) Pin Diode
Datasheet	MPP4204 Datasheet

📁 Similar Datasheet

Part Number	Description	Manufacturer
MPP4400	MMSM PIN Diodes	Microchip
MPP4403	MMSM PIN Diodes	Microchip
MPP473x2xxxx	Plastic Flim Capacitors	Camel
MPP474x2xxxx	Plastic Flim Capacitors	Camel
MPP	Plastic Flim Capacitors	Camel

Other Datasheets by Microsemi (now Microchip Technology)

Part Number	Description
MPP4201	(MPP4201 - MPP4700) Pin Diode
MPP4202	(MPP4201 - MPP4700) Pin Diode
MPP4203	(MPP4201 - MPP4700) Pin Diode
MPP4700	(MPP4201 - MPP4700) Pin Diode

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text

MPP4201 – MPP4204, MPL4700 MICROWAVE PRODUCTS DIVISION MONOLITHIC MICROWAVE SURFACE MOUNT MICRO-PAK PIN DIODES PRODUCT PREVIEW DESCRIPTION KEY FEATURES !" Tape and Reeled for Automatic Assembly !" Low Series Inductance (<0.2nH typical) !" Low Parasitic Capacitance (0.06 pf typical) !" Meets All Commercial Qualification Requirements !" 0204 Outline !" Very low thermal resistance W W W . Microsemi . COM This series of surface mount PIN diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled.