GENERAL DESCRIPTION
CASE OUTLINE 55KT FET (Common Gate) See outline drawing ABSOLUTE MAXIMUM RATINGS
Voltage and Current Drain-Source (VDSS) Gate-Source (VGS) Drain Current (Idg) Temperatures Storage Temperature Operating Junction Temperature 250 V - 1V 35A -65 to +150°C +250°C ELECTRICAL CHARACTERISTICS
@ 25°C SYMBOL CHARACTERISTICS TEST CONDITIONS MIN TYP MAX UNITS Idss1 Drain-Source Leakage Current VGS = -15V, VDG = 95V Igss Gate-Source Leakage Current VGS = -20V, VDS = 0V θJC1 Thermal Resistance Pout=1250W 750 µA 50 µA 0.15 ºC/W FUNCTIONAL CHARACTERISTICS @ 25°C, Vdd = 125V, Idq(avg) = 500 mA, Freq = 155 MHz, GPG Pin ηd ψ Po +1dB Common Gate Power Gain Input Power Drain Efficiency Load Mismatch Power Output – Higher Drive Pout = 1250 W, Pulsed Pulse Width = 300us, DF = 10% F = 155 MHz, Pout =1250W F = 155 MHz, Pout = 1250W F = 155 MHz, Pin = 190 W 9.0 9.5 150 160 60 10:1 1400 Vsg Source-Gate Voltage Set for Idq(avg) = 500 mA 3.0 10.0 dB W % W Volts Dec 2008 Microsemi reserves the right to change, without notice, the specifications and information contained herein.