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1N5190 - FAST RECOVERY GLASS RECTIFIERS

Download the 1N5190 datasheet PDF. This datasheet also covers the 1N5186 variant, as both devices belong to the same fast recovery glass rectifiers family and are provided as variant models within a single manufacturer datasheet.

General Description

This “fast recovery” rectifier diode series is military qualified and is ideal for high-reliability applications where a failure cannot be tolerated.

Key Features

  • JEDEC registered 1N5186 thru 1N5190 series.
  • Voidless hermetically sealed glass package.
  • Working Peak Reverse Voltage 100.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (1N5186-Microsemi.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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1N5194 GENERAL PURPOSE SILICON DIODES Compensated Deuices Incorporated
1N5194UR GENERAL PURPOSE SILICON DIODES Compensated Deuices Incorporated

Other Datasheets by Microsemi (now Microchip Technology)

Part Number Description
1N5194 SWITCHING DIODE
1N5195 SWITCHING DIODE
1N5196 SWITCHING DIODE
1N5181 High Voltage Rectifier
1N5182 High Voltage Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
1N5186 thru 1N5188, 1N5190 Available on commercial versions VOIDLESS-HERMETICALLY SEALED FAST RECOVERY GLASS RECTIFIERS Qualified per MIL-PRF-19500/424 DESCRIPTION This “fast recovery” rectifier diode series is military qualified and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 3.0 amp rated rectifiers for working peak reverse voltages from 100 to 600 volts are hermetically sealed with voidless-glass construction using an internal “Category 1” metallurgical bond. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages.