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1PMT4105 - Powermite Low Noise 1 Watt Zener Diodes

Download the 1PMT4105 datasheet PDF. This datasheet also covers the 1PMT4614 variant, as both devices belong to the same powermite low noise 1 watt zener diodes family and are provided as variant models within a single manufacturer datasheet.

General Description

This Microsemi Powermite surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant.

Key Features

  • include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment. Important: For the latest information, visit our website http://www. microsemi. com.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (1PMT4614-Microsemi.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Microsemi (now Microchip Technology)

Part Number Description
1PMT4100 Powermite Low Noise 1 Watt Zener Diodes
1PMT4101 Powermite Low Noise 1 Watt Zener Diodes
1PMT4102 Powermite Low Noise 1 Watt Zener Diodes
1PMT4103 Powermite Low Noise 1 Watt Zener Diodes
1PMT4104 Powermite Low Noise 1 Watt Zener Diodes

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
1PMT4614e3 – 1PMT4627e3, 1PMT4099e3 – 1PMT4135e3 Compliant Powermite Low Noise 1 Watt Zener Diodes DESCRIPTION This Microsemi Powermite surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment. Important: For the latest information, visit our website http://www.microsemi.com.