1PMT5930B
DESCRIPTION
® In Microsemi's Powermite surface mount package, these zener diodes provide power-handling capabilities (3.0 WATTS) found in larger packages. ®
In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.
DO-216
FEATURES
- Surface Mount Packaging
- Integral Heat Sink Locking Tabs
- patible with automatic insertion equipment
- Full metallic bottom eliminates flux entrapment
- Zener voltage 3.3 to 200 Volts
- Low reverse leakage
- Tight tolerance available
- ESD Rating of >16k V per human body model
MAXIMUM RATINGS
- Junction and storage temperatures: -55°C to +150°C
- DC power dissipation: 3.0 watt with TAB 1 60°C
- Forward voltage:
@ 200 m A 1.2 volts
Mechanical Specifications
CIRCUIT DIAGRAM
MECHANICAL CHARACTERISTICS
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