A2F200 Datasheet | Microsemi

Revision 14 Smart Fusion Customizable System-on-Chip (c So C) Microcontroller Subsystem (MSS) - Hard 100 MHz 32-bit ARM® Cortex®-M3 Processor - 1.25 DMIPS/MHz Throughput from Zero Wait State Memory - Memory Protection Unit (MPU) - Single Cycle Multiplication, Hardware Divide - JTAG Debug (4 wires), Serial Wire Debug (SWD, 2 wires), and Single Wire Viewer (SWV) Interfaces - Internal Memory - Embedded Nonvolatile Flash Memory (e NVM), 128 Kbytes to 512 Kbytes - Embedded High-Speed SRAM (e SRAM), 16 Kbytes to 64 Kbytes, Implemented in 2 Physical Blocks to Enable Simultaneous Access from 2 Different Masters - Multi-Layer AHB munications Matrix - Provides up to 16 Gbps of On-Chip Memory Bandwidth,1 Allowing Multi-Master Schemes - 10/100 Ethernet MAC with RMII Interface2 - Programmable External Memory Controller, Which Supports: - Asynchronous Memories - NOR Flash, SRAM, PSRAM - Synchronous SRAMs - Two I2C Peripherals - Two 16550 patible UARTs - Two SPI Peripherals - Two 32-bit Timers - 32-bit Watchdog Timer - 8-channel DMA Controller to Offload the Cortex-M3 from Data Transactions - Clock Sources - 32 KHz to 20 MHz Main Oscillator - Battery-Backed 32 KHz Low Power Oscillator with Real-Time Counter (RTC) - 100 MHz Embedded RC Oscillator; 1% Accurate - Embedded Analog PLL with 4 Output Phases (0, 90, 180, 270) High-Performance FPGA - Based on proven Pro ASIC®3 FPGA Fabric - Low Power, Firm-Error Immune 130-nm, 7-Layer Metal, Flash-Based CMOS Process - Nonvolatile, Instant On, Retains Program When Powered Off - 350 MHz System Performance - Embedded SRAMs and FIFOs - Variable Aspect Ratio 4,608-Bit SRAM Blocks - x1, x2, x4, x9, and x18 Organizations - True Dual-Port SRAM (excluding...