Microsemi CHF5KP15
Patented Flip Chip Series
FEATURES
●●
●
●
●
● Unidirectional and bidirectional Fully glass passivated 5000 watt (10/1000 µs) Eliminates wire bonding No overshoot Provides optimum voltage clamping
MAXIMUM RATINGS
MECHANICAL●
●
●
●
●
●
● Max Junction Temperature: 1750C Storage Temperature: -550C to +1750C Flip Chip Peak Pulse Power: 5000 Watts (10/1000 µs) Maximum non-repetitive peak power 5000 Watts (10/1000 µs) Total continuous power dissipation @ Tlead = 750C 10 W Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL
●
●
● Weight: 0.8 grams (approximate) Cathode mark on top side Metallization Cr - Ag - Au (Both Sides) PACKAGING
●
● Waffle package 15 pieces per pack (STANDARD) BIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS PAD SIZE & CIRCUIT MSC0997.PDF ISO 9001 CERTIFIED REV H 8/18/99 CHF5KP5.0 thru CHF5KP110CA UNIDIRECTIONAL ALL DIMENSIONS NOMINAL FLIP CHIP DIMENSIONS
● PAD SIZE & CIRCUIT VBR 30V and above VBR 30V and below POWER DERATING PEA...