Microsemi CHFP6KE28
Patented Flip-Chip Series
| Part No. | CHFP6KE28 |
|---|---|
| Datasheet | CHFP6KE28 Download |
| Manufacturer |  Microsemi |
| Description | Patented Flip-Chip Series |
| Buy | Stock & Price |
FEATURES
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● Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series
MAXIMUM RATINGS
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● Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL
● Weight: 0.01 grams (approximate)
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● Solderable standoff tabs .040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces PACKAGING BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT VBR above 30 V VBR 30V and below MSC1596.PDF ISO 9001 CERTIFIED REV B 3/...
