M1.5KE10A Datasheet | Microsemi

FEATURES - High reliability controlled devices with wafer fabrication and assembly lot traceability - 100 % surge tested devices - Suppresses transients up to 1500 watts @ 10/1000 µs - Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes specify various screening and conformance inspection options based on MIL-PRF-19500. Refer to Micro Note 129 for more details on the screening options. - Surface mount equivalent packages are available as MSMC(G)(J)5.0A - SMC(G)(J)170CA (consult factory for other surface mount options) - Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B - Ro HS pliant devices available by adding “e3” suffix - 3σ lot norm screening performed on Standby Current ID APPLICATIONS / BENEFITS - Protection from switching transients and induced RF - Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4 with fast response - Secondary lightning protection per IEC 61000-4-5 with 42 Ohms source impedance: o Class 1: M1.5KE6.8A to M1.5KE200CA o Class 2: M1.5KE5.0A to M1.5KE180CA o Class 3: M1.5KE5.0A to M1.5KE91CA o Class 4: M1.5KE5.0A to M1.5KE43CA - Secondary lightning protection per IEC61000-4-5 with 12 Ohms source impedance: o Class 1 : M1.5KE5.0A to M1.5KE110CA o Class 2: M1.5KE5.0A to M1.5KE56CA o Class 3: M1.5KE5.0A to M1.5KE27ACA o Class 4: M1.5KE5.0A to M1.5KE13CA - Secondary lightning protection per IEC61000-4-5 with 2 Ohms source impedance: o Class 2: M1.5KE5.0A to M1.5KE24CA o Class 3: M1.5KE5.0A to M1.5KE12CA CASE 1 MAXIMUM RATINGS - Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1, 2, and 3) with impulse repetition rate (duty factor) of 0.01 % or less - tclamping (0 volts to VBR min.): < 100 ps theoretical for unidirectional and < 5 ns for bidirectional - Operating and Storage temperature: -65 ºC to +150 ºC - Thermal Resistance: 22 ºC/W junction to lead at 3/8 inch (10 mm) from body, or 82 ºC/W junction to ambient when mounted on...