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MM196 - 6 MOSFET Multi-Chip Module

General Description

KEY

Key Features

  • !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W . Microsemi . COM The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100. This device is also available as bare die, see Microsemi data sheet MSAFA1N100D. The MM196 allows users to externally connect the MOSFETs via a motherboard or next assem.

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MM196 6 MOSFET Multi-Chip Module SANTA ANA DIVISION PRELIMINARY SPECIFICATION DESCRIPTION KEY FEATURES !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W . Microsemi . COM The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100. This device is also available as bare die, see Microsemi data sheet MSAFA1N100D. The MM196 allows users to externally connect the MOSFETs via a motherboard or next assembly substrate into any configuration desired. Custom variations of this product incorporating other Microsemi protection die and/or passive components are available by contacting the factory.