MM196 Overview
KEY FEATURES !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W . The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100.