MM196 Overview
Key Features
- !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W
- COM The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package
- This device is also available as discrete individual packaged Powermite3, see Microsemi data sheet UPF1N100
- This device is also available as bare die, see Microsemi data sheet MSAFA1N100D
- The MM196 allows users to externally connect the MOSFETs via a motherboard or next assembly substrate into any configuration desired
- !" Sn63/Pb37 solder bumps (Alternate attach methods available) !" Maximum switch voltage 1000V
