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MPC8200 - PASSIVE DEVICES - MMSM Capacitors

Download the MPC8200 datasheet PDF. This datasheet also covers the MPC8300 variant, as both devices belong to the same passive devices - mmsm capacitors family and are provided as variant models within a single manufacturer datasheet.

General Description

KEY

Key Features

  • Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical.
  • Surface Mount design.
  • Broadband Performance through X-Band.
  • Available on Tape & Reel for automated pick & place assembly.
  • Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MPC8300_Microsemi.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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Other Datasheets by Microsemi (now Microchip Technology)

Part Number Description
MPC8010 PASSIVE DEVICES - MMSM Capacitors
MPC8020 PASSIVE DEVICES - MMSM Capacitors
MPC8050 PASSIVE DEVICES - MMSM Capacitors
MPC8100 PASSIVE DEVICES - MMSM Capacitors
MPC8300 PASSIVE DEVICES - MMSM Capacitors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MPC8010-MPC8300 TM ® PASSIVE DEVICES – MMSM® Capacitors RoHS COMPLIANT www.DataSheet4U.com DESCRIPTION KEY FEATURES  Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical  Surface Mount design  Broadband Performance through X-Band  Available on Tape & Reel for automated pick & place assembly  Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band.