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MPC8300 - PASSIVE DEVICES - MMSM Capacitors

General Description

KEY

Key Features

  • Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical.
  • Surface Mount design.
  • Broadband Performance through X-Band.
  • Available on Tape & Reel for automated pick & place assembly.
  • Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MPC8010-MPC8300 TM ® PASSIVE DEVICES – MMSM® Capacitors RoHS COMPLIANT www.DataSheet4U.com DESCRIPTION KEY FEATURES  Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical  Surface Mount design  Broadband Performance through X-Band  Available on Tape & Reel for automated pick & place assembly  Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band.