MPP4700 Datasheet PDF

DESCRIPTION

KEY

FEATURES

!" Tape and Reeled for Automatic Assembly !" Low Series Inductance (<0.2nH typical) !" Low Parasitic Capacitance (0.06 pf typical) !" Meets All Commercial Qualification Requirements !" 0204 Outline !" Very low thermal resistance W W W . Microsemi . COM This series of surface mount PIN diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through 12GHz. IMPORTANT: For the most current data, consult MICROSEMI’s website:

APPLICATIONS

/BENEFITS

APPLICATIONS

/BENEFIT S !" 2.4 GHz PCS communications !" 5.7 GHz Wireless LANS !" Solid State Switches, Attenuators, Limiters !" Phase Shifters !" Widest bandwidth of any commercial surface mounted devic...