MXP22-C Overview
714.557.5989 MXP22-C Monolithic Photodiode Array - Chip.
MXP22-C Key Features
- Dielectrically Isolated Diodes Aluminum Wire bondable Backside Metallization
- Gold Die Attach methods: Eutectic or Epoxy
MXP22-C Datasheet Details
| Part number | MXP22-C |
|---|---|
| Datasheet | MXP22-C_MicrosemiCorporation.pdf |
| File Size | 38.87 KB |
| Manufacturer | Microsemi (now Microchip Technology) |
| Description | Monolithic Photodiode Array-Chip |
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