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SM1002 - MELF PIN Diodes

General Description

This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction.

The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations.

Key Features

  • Non-Magnetic1 Versions Ideal for MRI.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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® TM DESCRIPTION This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours. RoHS compliant versions of these products meet RoHS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements. SM0502 – SM1003 CONTROL DEVICES Surface Mount – MELF PIN Diodes RoHS Compliant Versions .