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WS128K32-XG2UX - 128Kx32 SRAM

General Description

I/O0-31 A0-16 WE1-4# CS1-4# OE# VCC GND NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected OE# A0-16 Block Diagram WE#1 CS#1 WE#2 CS#2 WE#3 CS#3 128K x 8 128K x 8 128K x 8 WE#4 CS#4 128K x 8 8 I/O 0-7 8 I/O 8-15 8 I/O 16-23

Key Features

  •  Access Times of 15, 17, 20, 25, 35, 45, 55ns.
  •  MIL-STD-883 Compliant Devices Available.
  •  Packaging.
  • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400).
  • 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package 502).
  • 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510).
  • 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.200") high, (Package 528).
  •  Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8.
  •  Comme.

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Other Datasheets by Microsemi (now Microchip Technology)

Part Number Description
WS128K32-XG2LX 128Kx32 SRAM
WS128K32-XG4TX 128Kx32 SRAM
WS128K32-XH1X 128Kx32 SRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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WS128K32-XXX 128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595 FEATURES  Access Times of 15, 17, 20, 25, 35, 45, 55ns  MIL-STD-883 Compliant Devices Available  Packaging • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400) • 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package 502) • 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510) • 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.