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AS8FLC2M32 Datasheet Multi-Chip Module

Manufacturer: Micross

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Overview

FLASH AS8FLC2M32 Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.

Key Features

  • 64Mb device, total density, organized as 2M x 32.
  • Bottom Boot Block (Sector) Architecture (Contact factory for top boot).
  • Operation with single 3.0V Supply.
  • Available in multiple Access time variations.
  • Individual byte control via individual byte selects (CSx).
  • Low Power CMOS.
  • 1,000,000 Erase/Program Cycles.
  • Minimum 1,000,000 Program/Erase Cycles per sector guaranteed.
  • Sector Architecture:.
  • One 16K byte, t.

📁 Similar Datasheet

Brand Logo Part Number Description Manufacturer
Austin Semiconductor Logo AS8FLC2M32 3.3Volt Boot Block FLASH Array Austin Semiconductor

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