BFCN-8650+ Overview
Key Features
- Feature Small Size (3.20mm x1.6 mm) Advantages Allows for high layout density of circuit boards, while minimizing affects of parasitics
- Rejection peaks close to pass band Provides good rejection of signals close to the pass band, for improved system performance
- Wrap around termination LTCC construction Provides excellent solderability and easy visual inspection capability
- Provides a rugged package that is well suited for tough environments including high humidity and high temperature extremes
- Box 350166, Brooklyn, NY 11235-0
