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CMA-81 - Monolithic Amplifier

Download the CMA-81 datasheet PDF. This datasheet also covers the CMA-81-Mini variant, as both devices belong to the same monolithic amplifier family and are provided as variant models within a single manufacturer datasheet.

General Description

CMA-81+ (RoHS compliant) is a wideband amplifier offering high dynamic range.

It uses patented Transient Protection Darlington configuration and is fabricated using InGaP HBT technology.

Key Features

  • Feature Hermetically Sealed Wideband, DC to 6 GHz High IP3 vs. DC power consumption.
  • +41 dBm at 0.1 GHz.
  • +38 dBm at 1 GHz Advantages Ideal for use anywhere long-term reliability adds bottom-line value: high moisture areas, busy production lines, high-speed distribution centers, heavy industry, outdoor settings, and unmanned facilities, as well as military.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (CMA-81-Mini-Circuits.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number CMA-81
Manufacturer Mini-Circuits
File Size 303.11 KB
Description Monolithic Amplifier
Datasheet download datasheet CMA-81 Datasheet

Full PDF Text Transcription for CMA-81 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for CMA-81. For precise diagrams, and layout, please refer to the original PDF.

Wideband, High Dynamic Range, Ceramic Monolithic Amplifier 50Ω DC to 6 GHz The Big Deal • Ceramic, hermetically sealed, nitrogen filled • Low profile case, 0.045” • High ...

View more extracted text
ermetically sealed, nitrogen filled • Low profile case, 0.045” • High IP3, +38 dBm • High POUT, +19.5 dBm CMA-81+ CASE STYLE: DL1721 Product Overview Mini-Circuits’ CMA-81+ is a wideband monolithic amplifier providing high dynamic range. It uses patented, Transient Protection Darlington Configuration circuit architecture and is fabricated using InGaP HBT technology. The amplifier is bonded to a multilayer integrated LTCC substrate, then hermetically sealed under a controlled Nitrogen atmosphere with gold-plated cover, eutectic Au-Sn solder, and Ni-Pd-Au termination finish.