Datasheet4U Logo Datasheet4U.com

CM30TF-12H - IGBT Module

Datasheet Summary

Description

Mitsubishi IGBT Modules are designed for use in switching applications.

Each module consists of six IGBTs in a three phase bridge configuration, with each transistor having a reverse-connected super-fast recovery free-wheel diode.

Features

  • ٗ Low Drive Power ٗ Low VCE(sat) ٗ Discrete Super-Fast Recovery Free-Wheel Diode ٗ High Frequency Operation ٗ Isolated Baseplate for Easy Heat Sinking.

📥 Download Datasheet

Datasheet preview – CM30TF-12H

Datasheet Details

Part number CM30TF-12H
Manufacturer Mitsubishi Electric Semiconductor
File Size 53.08 KB
Description IGBT Module
Datasheet download datasheet CM30TF-12H Datasheet
Additional preview pages of the CM30TF-12H datasheet.

📁 Similar Datasheet

  • CM30TF-12H - IGBT Module (Powerex Power Semiconductors)
  • CM30TF-24H - IGBT Module (Powerex Power Semiconductors)
  • CM3002 - Micropower 1.0A Low Dropout CMOS Regulators (California Micro Devices)
  • CM3003 - 1.5 Amp Dual Mode Low Dropout CMOS Regulator (California Micro Devices)
  • CM3004 - 1.0 Amp Dual Mode Low-Dropout CMOS Regulator (California Micro Devices)
  • CM300DC-24NFM - Dual IGBT (Powerex)
  • CM300DU-12F - IGBT Module (Powerex Power Semiconductors)
  • CM300DU-12H - Dual IGBT Module (Powerex Power Semiconductors)
  • CM300DU-24F - IGBT Module (Powerex Power Semiconductors)
  • CM300DU-24H - Dual IGBT Module (Powerex Power Semiconductors)
Other Datasheets by Mitsubishi Electric Semiconductor

Full PDF Text Transcription

Click to expand full text
MITSUBISHI IGBT MODULES CM30TF-12H MEDIUM POWER SWITCHING USE INSULATED TYPE A C K GUP EUP S - DIA. (2 TYP.) H N H GVP EVP GWP EWP P D J U N GUN EUN GVN EVN GWN EWN V W L E R Q B R Q R P TAB #250, t = 0.8 TAB #110, t = 0.5 G M F R P Description: Mitsubishi IGBT Modules are designed for use in switching applications. Each module consists of six IGBTs in a three phase bridge configuration, with each transistor having a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.
Published: |