1SMB5951BT3
Key Features
- A Complete Voltage Range - 3.3 to 200 Volts
- Flat Handling Surface for Accurate Placement
- Package Design for Top Side or Bottom Circuit Board Mounting
- Available in Tape and Reel Mechanical Characteristics: CASE: Void-free, transfer-molded plastic MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds FINISH: All external surfaces are corrosion resistant with readily solderable leads POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, cathode will be positive with respect to anode. MOUNTING POSITION: Any WEIGHT: Modified L-Bend providing more contact area to bond pad WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia
