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DSP56374 - high-density CMOS device

Download the DSP56374 datasheet PDF. This datasheet also covers the DSP variant, as both devices belong to the same high-density cmos device family and are provided as variant models within a single manufacturer datasheet.

General Description

of the DSP56374 and are required to design properly with the part.

Documentation is available from a local Freescale Semiconductor, Inc.

Key Features

  • . . 3 3 Documentation.
  • . . 5 4 Signal Groupings.
  • 5 5 Maximum Ratings.
  • . . . . 25 6 Power Requirements.
  • . 26 7 Thermal Characteristics.
  • . . . . 27 8 DC Electrical Characteristics.
  • 28 9 AC Electrical Characteristics.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DSP-56374.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Freescale Semiconductor Data Sheet: Technical Data DSP56374 Rev. 4.2, 1/2007 DSP56374 Data Sheet 1 Overview The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs. NOTE This document contains information on a new product. Specifications and information herein are subject to change without notice. For software or simulation models (for example, IBIS files), contact sales or go to www.freescale.com. The DSP56374 supports digital audio applications requiring sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56374 uses the high performance, single-clock-per-cycle DSP56300 core family of programmable CMOS digital signal processors (DSPs) combined with the audio signal processing capability of the Freescale Semiconductor, Inc.