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EB346 - Semiconductor Products Sector Engineering Bulletin

Description

of the pinout change for the 144-pin TQFP package.

120] pF For MF > 4: CPCAP = (1100 × MF) pF See Table 3 for details.

Features

  • 3 Input Power Changes One method to increase the operating frequency of an integrated circuit is to “shrink” the die (that is, reduce the die dimensions, both linearly and vertically). Reducing the die size can yield additional benefits, such as a reduction of power consumption, but can also result in other functional changes. The DSP56309 is a “shrink” of the DSP56302. This die size reduction enables the DSP56309 to achieve higher operating frequencies. Decreasing the die size, however, requ.

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Datasheet Details

Part number EB346
Manufacturer Motorola Inc
File Size 246.73 KB
Description Semiconductor Products Sector Engineering Bulletin
Datasheet download datasheet EB346 Datasheet
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    Full PDF Text Transcription

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    Freescale Semiconductor, Inc. MOTOROLA Semiconductor Products Sector Engineering Bulletin Order Number EB346/D: Rev. 2 4/20/2001 Functional Differences Between DSP56302 and DSP56309 (formerly DSP56302A) Contents 1 2 3 4 5 6 Purpose of this Document .......... 1 Differences Overview ................. 1 Input Power Changes ................. 2 I/O Power Changes..................... 4 PLL Input Capacitor (CPCAP)... 4 Operating Modes ........................ 5 1 Freescale Semiconductor, Inc... Purpose of this Document To meet the increasing demands for higher performance and lower power consumption, an advanced DSP56302 has been designed; it is was formerly known as DSP302A; it is now designated DSP56309. The new part is designed to be a functional replacement for the DSP56302.
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