AN555
Description
igure 2 displays the ponent parts on a stud-mounted SOE package.
Applications
- similar in construction. The body of the package is a Berylium Oxide (BeO) disc. Berylium Oxide was chosen due to its high thermal conductivity. Attached to the bottom of the disc is a copper stud which is for heat transfer and mechanical mounting. The lead frame is attached to a metalized pattern on to the top surface of the BeO disc. The actual shape of the leads differs between the various package types. Finally an Alumina ceramic cap is attached to the top of the disc over the leads providing a protective cover for the transistor die. An understanding of the basic structure of the SOE package is essential to proper usage of these devices in respect to heat-sinking and mechanical mounting. Since these two areas present the greatest problem to users, they will be discussed in detail
