MBR0540T1 Datasheet | Motorola Semiconductor

features : - Guardring for Stress Protection - Very Low Forward Voltage - Epoxy Meets UL94, VO at 1/8″ - Package Designed for Optimal Automated Board Assembly Mechanical Characteristics: - Reel Options: 3,000 per 7 inch reel / 8 mm tape CASE 425- 04, Style 1 - Reel Options: 10,000 per 13 inch reel / 8 mm tape SOD- 123 - Device Marking: B4 - Polarity Designator: Cathode Band - Weight: 11.7 mg (approximately) - Case: Epoxy Molded - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260°C max. for 10 Seconds MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 115°C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 k Hz, TC = 115°C) Non- Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Storage / Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) Symbol VRRM VRWM VR IO IFRM IFSM Tstg, TC TJ dv/dt Value 40 Unit V Data Shee . 0.5 1.0 5.5 - 55 to 150 - 55 to 150 1,000 A A A °C °C V/m s THERMAL CHARACTERISTICS Thermal Resistance - Junction- to- Lead (2) Thermal Resistance - Junction- to- Ambient (3) Rtjl Rtja TJ = 25°C 0.51 0.62 IR TJ = 25°C 20 10 118 206 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (1) (IF = 0.5 A) (IF = 1 A) Maximum Instantaneous Reverse Current (VR = 40 V) (VR = 20 V) (1) Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%. (2) Mounted with minimum remended pad size, PC Board FR4. (3) 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board. Rev 2 TJ = 100°C 0.46 0.61 TJ = 100°C 5,000 13,000 V m A This document contains information on a new product. Specifications and information herein are subject to change without notice. . Device ©Rectifier Motorola, Inc. 1996 Data Data Sheet 4 U...