MBRA130LT3 Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRA130LT3/D Advance Information Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package . employing the Schottky Barrier principle in a metal to silicon power rectifier.
MBRA130LT3 Key Features
- pact Package with J-Bend Leads Ideal for Automated Handling
- Highly Stable Oxide Passivated Junction
- Guardring for Over-Voltage Protection
- Low Forward Voltage Drop Mechanical Characteristics
- Case: Molded Epoxy
- Epoxy Meets UL94, VO at 1/8″
- Weight: 70 mg (approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
- Polarity: Notch in Plastic Body Indicates Cathode Lead