Download MBRB3030CT Datasheet PDF
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MBRB3030CT Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRB3030CT/D SWITCHMODE™ Power Rectifier Using the Schottky Barrier principle with a proprietary barrier metal. These state of the art devices have the following.

MBRB3030CT Key Features

  • Guardring for Stress Protection
  • Maximum Die Size
  • 150°C Operating Junction Temperature
  • Short Heat Sink Tab Manufactured
  • Not Sheared Mechanical Characteristics
  • Case: Epoxy, Molded
  • Weight: 1.7 grams (approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
  • Shipped 50 Units per Plastic Tube