MBRV7030CTL Description
MOTOROLA Designer's SEMICONDUCTOR TECHNICAL DATA Order this document by MBRV7030CTL/D ™ Data Sheet SWITCHMODE™ MBRV7030CTL Motorola Preferred Device Schottky Power Rectifier D3PAK Power Surface Mount Package Employing the Schottky Barrier principle in a large area metal to silicon power rectifier.
MBRV7030CTL Key Features
- pact Package Ideal for Automated Handling 1
- Short Heat Sink Tab Manufactured
- Not Sheared 3
- Highly Stable Oxide Passivated Junction
- Guardring for Over-voltage Protection
- Low Forward Voltage Drop
- Monolithic Dual Die Construction. May be Paralleled for High Current Output. Mechanical Characteristics
- Case: Epoxy, Molded
- Weight: 2 Grams (approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable