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MOTOROLA
Designer's
SEMICONDUCTOR TECHNICAL DATA
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MBRV7030CTL
Motorola Preferred Device
Schottky Power Rectifier
D3PAK Power Surface Mount Package
Employing the Schottky Barrier principle in a large area metal–to–silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. • Compact Package Ideal for Automated Handling 1 • Short Heat Sink Tab Manufactured — Not Sheared 3 • Highly Stable Oxide Passivated Junction • Guardring for Over–voltage Protection • Low Forward Voltage Drop • Monolithic Dual Die Construction. May be Paralleled for High Current Output.