MPX2300D Overview
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub module ponent or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier...
MPX2300D Key Features
- Low Cost
- Patented piezoresistive strain gauge implant, temperature pensation and calibration all integrated on a single, monolith
- Pressure Range Available: 0-300 mmHg
- Polysulfone (Mindell S-1000) Case Material (Medical, Class VI Approved)
