Datasheet Summary
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications
Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub- module ponent or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola’s unique sensor die with its patented, piezoresistive implant technology, along with the added feature of on- chip, thin- film temperature pensation and calibration. Features
:
- Low Cost
- Patented piezoresistive strain gauge implant, temperature...
