MSC2295-CT1 Datasheet | Motorola Semiconductor

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MSC2295- BT1/D NPN RF Amplifier Transistors Surface Mount COLLECTOR 3 MSC2295-BT1 MSC2295-CT1 Motorola Preferred Devices 2 BASE 1 EMITTER 2 1 MAXIMUM RATINGS (TA = 25°C) Rating Collector- Base Voltage Collector- Emitter Voltage Emitter- Base Voltage Collector Current - Continuous Symbol V(BR)CBO V(BR)CEO V(BR)EBO IC Value 30 20 5.0 30 Unit Vdc Vdc Vdc m Adc CASE 318D- 03, STYLE 1 SC- 59 THERMAL CHARACTERISTICS Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 200 150 .. Unit m W °C °C - 55 ~ +150 ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Collector- Base Cutoff Current (VCB = 10 Vdc, IE = 0) DC Current Gain(1) (VCB = 10 Vdc, IC = - 1.0 m Adc) Collector- Gain - Bandwidth Product (VCB = 10 Vdc, IE = - 1.0 m Adc) Reverse Transistor Capacitance (VCE = 10 Vdc, IC = 1.0 m Adc, f = 10.7 MHz) 1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%. Symbol ICBO h FE MSC2295- BT1 MSC2295- CT1 f T Cre 70 110 150 - 140 220 - 1.5 MHz p F Min - Max 0.1 Unit µAdc - DEVICE MARKING Marking Symbol MSC2295- BT1 MSC2295- CT1 The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the part was manufactured. Thermal Clad is a trademark of the Bergquist pany Preferred devices are Motorola remended choices for future use and best overall value. © Motorola, Inc. 1996 Motorola Small- Signal Transistors, FETs and Diodes Device Data MSC2295-BT1 MSC2295-CT1 MINIMUM REMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder...