MURHB840CT Datasheet (PDF) Download
Motorola Semiconductor
MURHB840CT

Key Features

  • Package Designed for Power Surface Mount Applications
  • Ultrafast 28 Nanosecond Recovery Times
  • 175°C Operating Junction Temperature
  • High Temperature Glass Passivated Junction
  • High Voltage Capability
  • Low Leakage Specified @ 150°C Case Temperature
  • Short Heat Sink Tab Manufactured — Not Sheared!
  • Similar in Size to Industry Standard TO–220 Package Mechanical Characteristics
  • Case: Epoxy, Molded 3
  • Weight: 1.7 grams (approximately)