MURP20040CT Datasheet (PDF) Download
Motorola Semiconductor
MURP20040CT

Key Features

  • Stable, High Temperature, Glass Passivated Junction
  • Case: Molded Epoxy with Metal Heatsink Base
  • Weight: 80 grams (approximately)
  • Finish: All External Surfaces Corrosion Resistant
  • Base Plate Torques: See procedure given in the Package Outline Section
  • Shipped 25 units per tray