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XPC855xxxx - (XPC860 Series) Family Hardware Specifications

Download the XPC855xxxx datasheet PDF. This datasheet also covers the XPC855TZP80D4 variant, as both devices belong to the same (xpc860 series) family hardware specifications family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • re) with thirty-two 32-bit general-purpose registers (GPRs).
  • The core performs branch prediction with conditional prefetch without conditional execution.
  • 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1).
  • 16-Kbyte instruction caches are four-way, set-associative with 256 sets; 4-Kbyte instruction caches are two-way, set-associative with 128 sets.
  • 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (XPC855TZP80D4_Motorola.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Motorola Semiconductor (now NXP Semiconductors)

Part Number Description
XPC855TZP80D4 (XPC860 Series) Family Hardware Specifications
XPC823 Power PC Microprocessor Reference Manual
XPC823D AC Electrical Specifications
XPC823E Power PC Microprocessor Reference Manual
XPC823ELE AC Electrical Specifications

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
( DataSheet : www.DataSheet4U.com ) Advance Information MPC860EC Rev. 6.3 9/2003 MPC860 Family Hardware Specifications This hardware specification contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC860 family. This hardware specification covers the following topics: Topic Section 1, “Overview” Section 2, “Features” Section 3, “Maximum Tolerated Ratings” Section 4, “Thermal Characteristics” Section 5, “Power Dissipation” Section 6, “DC Characteristics” Section 7, “Thermal Calculation and Measurement” Section 8, “Layout Practices” Section 9, “Bus Signal Timing” Section 10, “IEEE 1149.