AGQ210S
Overview
- 60±0.3 .417±.012 7.20±0.3 .283±.012 5.20±0.2 .205±.008
- 60±0.3 .417±.012
- 20±0.3 .283±.012 Max.5.40 .213 mm inch
- Compact flat body saves space With a small footprint of 10.6 mm (L) × 7.2 mm (W) .417 inch (L) × .283 inch (W) for space savings, it also has a very short height of 5.2 mm .205 inch. (Standard PC board type.)
- Outstanding surge resistance. Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)
- The use of twin crossbar contacts ensures high contact reliability. AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.
- Increased packaging density
