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UPA814TF - NPN SILICON HIGH FREQUENCY TRANSISTOR

General Description

The UPA814TF contains two NE688 NPN high frequency silicon bipolar chips.

NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration.

Key Features

  • SMALL.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com NPN SILICON HIGH FREQUENCY TRANSISTOR FEATURES • • • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm LOW HEIGHT PROFILE: Just 0.60 mm high HIGH COLLECTOR CURRENT: IC MAX = 100 mA 0.65 2.0 ± 0.2 1.3 2 1 UPA814TF OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE TS06 (Top View) 2.1 ± 0.1 1.25 ± 0.1 6 0.22 - 0.05 (All Leads) 5 +0.10 DESCRIPTION The UPA814TF contains two NE688 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications. 3 4 0.6 ± 0.1 0.45 0.13 ±0.05 0 ~ 0.