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UPC2745TB - 3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS

Datasheet Summary

Description

communications.

These ICs are packaged in super minimold package which is smaller than conventional minimold.

Features

  • High-density surface mounting : 6 pin super minimold package.
  • Supply voltage.
  • Wideband response.
  • High isolation : Recommended VCC = 2.7 to 3.3 V Circuit operation VCC = 1.8 to 3.3 V : fu = 2.7 GHzTYP. @mPC2745TB fu = 1.5 GHzTYP. @mPC2746TB : ISL = 38 dBTYP. @mPC2745TB ISL = 45 dBTYP. @mPC2746TB.

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Datasheet Details

Part number UPC2745TB
Manufacturer NEC
File Size 381.93 KB
Description 3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
Datasheet download datasheet UPC2745TB Datasheet
Additional preview pages of the UPC2745TB datasheet.

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Full PDF Text Transcription

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DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS mPC2745TB, mPC2746TB 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The mPC2745TB and mPC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The mPC2745TB and mPC2746TB have each compatible pin connections and performance to mPC2745T/ mPC2746T of conventional minimold version. So, in the case of reducing your system size, mPC2745TB/mPC2746TB are suitable to replace from mPC2745T/mPC2746T. nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration.
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