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UPC2747TB - 3 V/ SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

Datasheet Summary

Description

The µPC2747TB, µPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications.

These ICs are packaged in super minimold package which is smaller than conventional minimold.

Features

  • High-density surface mounting.
  • Supply voltage.
  • Noise figure.
  • Upper limit operating frequency : 6-pin super minimold package : VCC = 2.7 to 3.3 V : µPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz : µPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz : µPC2747TB ; fu = 1.8 GHz TYP. : µPC2748TB ; fu = 1.5 GHz TYP.

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Datasheet Details

Part number UPC2747TB
Manufacturer NEC
File Size 119.18 KB
Description 3 V/ SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS
Datasheet download datasheet UPC2747TB Datasheet
Additional preview pages of the UPC2747TB datasheet.

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Full PDF Text Transcription

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DATA SHEET µPC2747TB, µPC2748TB 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS BIPOLAR ANALOG INTEGRATED CIRCUITS DESCRIPTION The µPC2747TB, µPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The µPC2747TB, µPC2748TB have compatible pin connections and performance to µPC2747T, µPC2748T of conventional minimold version. So, in the case of reducing your system size, µPC2747TB, µPC2748TB are suitable to replace from µPC2747T, µPC2748T. These ICs are manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes.
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