UPC2762TB Datasheet | NEC

DESCRIPTION The µPC2762TB, µPC2763TB and µPC2771TB are silicon monolithic integrated circuits designed as amplifier for mobile munications. Each of the ICs is packaged in super minimold package which is smaller than conventional minimold. The µPC2762TB, µPC2763TB and µPC2771TB have patible pin connections and performance to µPC2762T, µPC2763T and µPC2771T of conventional minimold version. So, in the case of reducing your system size, µPC2762TB, µPC2763TB and µPC2771TB are suitable to replace from µPC2762T, µPC2763T and µPC2771T. These IC is manufactured using NEC’s 20 GHz f T NESAT™III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES - High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) - Supply voltage - Medium output power : VCC = 2.7 to 3.3 V : µPC2762TB: PO(1 d B) = +8.0 d Bm TYP. @ 0.9 GHz µPC2763TB: PO(1 d B) = +9.5 d Bm TYP. @ 0.9 GHz µPC2771TB: PO(1 d B) = +11.5 d Bm TYP. @ 0.9 GHz - Power gain : µPC2762TB: GP = 13 d B TYP. @ 0.9 GHz µPC2763TB: GP = 20 d B TYP. @ 0.9 GHz µPC2771TB: GP = 21 d B TYP. @ 0.9 GHz APPLICATIONS - Buffer amplifiers for mobile telephones : µPC2762TB, µPC2763TB - PA driver for PDC800M : µPC2771TB ORDERING INFORMATION Part Number Package Marking C1Z 6-pin super minimold C2A C2H Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel. µPC2762TB-E3 µPC2763TB-E3 µPC2771TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2762TB, µPB2763TB, µPC2771TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every...