NAWP470M6.3V4X5.5LBF
Key Features
- CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING
- REDUCED CASE SIZE (SMALLER THAN NACEW)
- SUIT FOR HIGH TEMPERATURE REFLOW SOLDERING (UP TO 250°C) RoHS
- 1,000 HOUR LOAD LIFE @ +105°C Compliant
- DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING includes all homogeneous materials NAWP Series
